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Automotive LED-Brake Light-7443 18HP3 |
2009-12-10 |
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Due to the rapid development of high-power LED, so that LED light sources have begun to enter the general lighting market, such as used in indoor and outdoor lighting, automotive lighting and special lighting, etc., shown in Figure 1. Traditional low-power type of package thermal resistance due to packaging up to 200K / W, above high-power LED can not be solved on the required cooling demand, domestic and foreign firms to actively develop various types of high-power package, such as the use of high thermal conductivity of metal materials and actively developed in recent years, ceramic materials. Applied to the LED lighting market products for the life and reliability requirements more stringent, so its package structure must be capable of high current density brought about by high thermal stress, to avoid potential damage, such as chips, resin yellow, gold wire breakage and de - layer and, therefore, how to reduce the thermal resistance LED packaging technology, has become an important research topic.
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